Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
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| Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
| Item | EP29LPSP Epoxy Compound | EP21TCHT-1 Epoxy Compound | EP37-3FLF Optically Clear, Highly Flexible Epoxy | EP4EN-80 Fast-curing Epoxy | Supreme 18TC Conductive Epoxy Adhesive |
| Citations | | | | | |
| Catalog Number | EP29LPSP | EP21TCHT-1 | EP37-3FLF | EP4EN-80 | Supreme 18TC |
| Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
| Description | Master Bond EP29LPSP is a two component epoxy adhesive, sealant that can withstand temperatures as low as 4K. It is resistant to cryogenic shocks ,from room temperature down to liquid helium temperatures, in a 5-10 minute time period. The system is NASA low outgassing approved. Additional features Master Bond EP29LPSP is a two component epoxy adhesive, sealant that can withstand temperatures as low as 4K. It is resistant to cryogenic shocks ,from room temperature down to liquid helium temperatures, in a 5-10 minute time period. The system is NASA low outgassing approved. Additional features include optical clarity, electrical insulation and low viscosity. EP29LPSP bonds well to a wide variety of substrates including metals, glass, ceramics, composites and many different plastics. The working life is long, a 100 gram mass will allow over 4-5 hours of working life.... Read More | Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It is a high strength adhesive and Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It is a high strength adhesive and produces bonds that are both tough and durable. It resists thermal cycling and many chemicals including water, fuels and most organic solvents. It has a service temperature range of 4K up to 400°F. It adheres well to metals, glass, ceramics, rubbers and many plastics. The hardened adhesive exhibits high thermal conductivity and superior electrical insulation. The thermal expansion coefficient is remarkably low. EP21TCHT-1 is widely used in aerospace, electronics, electronic, automotive and chemical industries. As a NASA qualified system, it is ideal for high vacuum type applications, particularly those where elevated temperature cures are not possible. It also passes MIL-STD-810G for fungal resistance, and withstands 1,000 hours at 85°C/85% RH.... Read More | EP37-3FLF is used in demanding applications where highly flexible, impact resistant bonds are required. It has low exotherm which makes it a superb potting, encapsulating and casting system, especially where wider cross section thicknesses are specified. | EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. | Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m·K)]. Heat transfer capabilities of this product are outstanding. Supreme 18TC also passes NASA low outgassing tests and can be used in applications in the aerospace, electronic, optical, specialty OEM and cryogenic industries.... Read More |
| Quantity | 1/2 pint kits, pint kits, quart kits, gallon kits, premixed and frozen syringes | 1/2 pint kits, pint kits, quart kits, gallon kits, premixed and frozen syringes | 1/2 pint kits, pint kits, quart kits, gallon kits, gun kits, premixed and frozen syringes | 1/2 pints, pints, quarts, gallons | Ounce, 1/2 pint, pint, quart, gallon |
| Type | Two part epoxy | Two part epoxy | Two part epoxy | One part epoxy | One part epoxy |
| Format | Inquire | Thixotropic paste | Inquire | Inquire | Smooth paste |
| Applications | Bonding, sealing, potting, casting | Bonding, sealing | Bonding, coating, casting | Bonding, small encapsulation | Bonding, sealing, coating, encapsulation |
| Applications | Bonding, Sealing | Bonding, Sealing | Bonding, Casting, Coating | Bonding, Encapsulating | Bonding, Coating, Sealing |
| Get Quote | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |