Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
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Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
Item | EP21TCHT-1 Epoxy Compound | EP21TDCS-LO Silver Conductive Epoxy Meets NASA Low Outgassing Standards | EP33 NASA Low Outgassing Epoxy Meets MIL-STD-883J | EP3UF No Mix, Thermally-conductive, Electrically-insulative Epoxy for Underfill Applications | EP41S-6 Epoxy System |
Citations | | | | | |
Catalog Number | EP21TCHT-1 | EP21TDCS-LO | EP33 | EP3UF | EP41S-6 |
Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
Description | Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It is a high strength adhesive and Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It is a high strength adhesive and produces bonds that are both tough and durable. It resists thermal cycling and many chemicals including water, fuels and most organic solvents. It has a service temperature range of 4K up to 400°F. It adheres well to metals, glass, ceramics, rubbers and many plastics. The hardened adhesive exhibits high thermal conductivity and superior electrical insulation. The thermal expansion coefficient is remarkably low. EP21TCHT-1 is widely used in aerospace, electronics, electronic, automotive and chemical industries. As a NASA qualified system, it is ideal for high vacuum type applications, particularly those where elevated temperature cures are not possible. It also passes MIL-STD-810G for fungal resistance, and withstands 1,000 hours at 85°C/85% RH.... Read More | EP21TDCS-LO is an electrically conductive, silver-filled epoxy widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries. It is suitable for cryogenic applications, serviceable down to 4K. | EP33 is a two part, room temperature curing epoxy system featuring high temperature resistance, good dimensional stability and very good chemical resistance. It is easily machinable, radiation resistant, and meets NASA low outgassing specifications. | EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. | Master Bond EP41S-6 is a two part epoxy system that meets UL 1203 for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations. The core of the UL 1203 test protocol is chemical resistance testing. EP41S-6 can be used in potentially explosive Master Bond EP41S-6 is a two part epoxy system that meets UL 1203 for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations. The core of the UL 1203 test protocol is chemical resistance testing. EP41S-6 can be used in potentially explosive environments, as defined in National Electrical Code, NFPA 70 (National Fire Protection Association). EP41S-6 is a thermally stable compound possessing a glass transition temperature of 145-150°C and serviceability from -80°F to +500°F [-62°C to +260°C]. It offers a high dielectric strength of 440 volts/mil at 75°F for a 0.125 inch thickness. This compound features good flow properties making it ideal for sealing and potting applications for electrical feedthroughs across various industries.... Read More |
Quantity | 1/2 pint kits, pint kits, quart kits, gallon kits, premixed and frozen syringes | 20 gram kits, 50 gram kits, 100 gram kits, 1 pound kits, premixed and frozen syringes | ½ pint kits, pint kits, quart kits, gallon kits | 10cc syringes, 30cc syringes | 1/2 pint kits, pint kits, quart kits, gallon kits |
Type | Two part epoxy | Two part epoxy | Two part epoxy | One part epoxy | Two part epoxy |
Format | Thixotropic paste | Paste | Inquire | Inquire | Inquire |
Applications | Bonding, sealing | Bonding, sealing | Bonding, sealing, coating | Bonding, underfill | Bonding, sealing, potting |
Applications | Bonding, Sealing | Bonding, Sealing | Bonding, Coating, Sealing | Bonding, Underfill | Bonding, Sealing |
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