Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
Explore and compare laboratory chemicals across leading suppliers at Labcompare; including access to product citations and first-hand reviews from our scientific community.
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| Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
| Item | EP30-2 Epoxy System | EP3UF No Mix, Thermally-conductive, Electrically-insulative Epoxy for Underfill Applications | EP42HT-3AO Thermally-conductive Potting Compound | EP62-1HTMed Non-Cytotoxic Epoxy | LED405FL3 Low Viscosity LED Curable Adhesive |
| Citations | | | | | |
| Catalog Number | EP30-2 | EP3UF | EP42HT-3AO | EP62-1HTMed | LED405FL3 |
| Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
| Description | Master Bond EP30-2 is a lower viscosity, two component epoxy for high performance bonding, sealing, coating and small potting applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures with a 10 to 1 mix ratio by weight. This system is recommended where low Master Bond EP30-2 is a lower viscosity, two component epoxy for high performance bonding, sealing, coating and small potting applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures with a 10 to 1 mix ratio by weight. This system is recommended where low viscosity is required, and for applications in which bonded assemblies must exhibit superior dimensional stability. Shrinkage upon cure is exceptionally low. It forms high strength and tough bonds which are resistant to thermal cycling and chemicals including water, oil and most organic solvents. It is serviceable over the temperature range of 4K to 300°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, rubbers and many plastics is excellent. It is electrically insulative and optically clear. Master Bond EP30-2 is widely used in the aerospace, electronic, optical, and specialty OEM industries. EP30-2 also meets NASA Low Outgassing specifications.... Read More | EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. | EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications and is NASA low outgassing approved. | EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity and therefore can be utilized in many medical device applications. It resists repeated sterilization cycles, including STERRAD® and autoclaving. | LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity. It utilizes a fluorescent dye for detection purposes, which enables easy visual inspection. |
| Quantity | 1/2 pint kits, pint kits, quart kits, gallon kits, gun kits | 10cc syringes, 30cc syringes | Ounce kits, 1/2 pint kits, pint kits, quart kits | Syringe kits, ?1/2 Pint kits, Pint kits, Quart kits, Gallon kits, pre-mixed and frozen syringes | Syringes, ?1/2 Pints, Pints, Quarts |
| Type | Two part epoxy | One part epoxy | Two part epoxy | Two part epoxy | One part epoxy |
| Applications | Bonding, sealing, coating, encapsulation | Bonding, underfill | Bonding, sealing, coating, encapsulation | Bonding, sealing | Bonding |
| Applications | Bonding, Coating, Sealing | Bonding, Underfill | Bonding, Coating, Sealing, Encapsulating | Bonding, Sealing | Bonding |
| Get Quote | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |